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Press Releases

 

 

 

 

Senseeker Expands Low-Noise Neon® Digital Readout IC Family for SWIR Applications

July 16, 2024 | Santa Barbara, CA

 

Senseeker Corp, a leading innovator of digital infrared image sensing technology, has announced the availability of the Neon® RD0131, an advanced digital readout integrated circuit (DROIC) that expands the Neon product family with the addition of a high definition 1280 x 1024 format.   read more 

 

 

 

 

 

Senseeker Offers Low-Noise Neon® Digital Readout IC for SWIR Applications

July 6, 2023 | Santa Barbara, CA

 

Senseeker, a leading innovator of digital infrared image sensing technology, has announced the availability of the Neon® RD0033, an advanced digital readout integrated circuit (DROIC) with low-noise performance, triple-gain modes and a 10 µm pitch pixel with a capacitive transimpedance amplifier (CTIA) front-end circuit.   read more 

 

 

 

 

 

Senseeker Launches High Dynamic Range Calcium™ Digital Pixel Readout IC

October 6, 2022 | Santa Barbara, CA

 

Senseeker, a leading innovator of digital infrared image sensing technology, has announced the availability of the Calcium™ RP0033, an advanced digital pixel readout IC (DPROIC) with > 120 dB dynamic range and a frame rate of up to 700 frames per second.   read more 

 

 

 

 

 

Senseeker Introduces Oxygen® Cryogenic Evaluation Kit

October 5, 2021 | Santa Barbara, CA

 

Senseeker, a leading innovator of digital infrared image sensing technology and cryogenic test solutions, has introduced a cryogenic test and evaluation kit for the Oxygen® RD0092 digital readout IC (DROIC) that enables focal plane array (FPA) developers to expedite their FPA development and evaluation process.   read more 

 

 

 

 

 

Senseeker Acquires SE-IR Corporation

March 2, 2021 | Santa Barbara, CA

 

Senseeker, a leading innovator of digital infrared image sensing technology, has completed the acquisition of SE-IR Corporation, an industry leader in the field of cryogenic test equipment and electronics. The combination of Senseeker's advanced digital readout IC technology and SE-IR's industry standard test Dewars and electronics is a highly complementary amalgam that will enable focal plane array (FPA) developers to expedite their FPA development and evaluation process.   read more 

 

 

 

 

 

Senseeker Introduces Sales of Oxygen® RD0092 DROIC Quarter Wafers

August 27, 2020 | Santa Barbara, CA

 

Senseeker, a leading innovator of digital infrared image sensing technology, has reduced the barriers to entry to procure state-of-the-art digital readout ICs by introducing sales of quarter wafers of the Oxygen® RD0092 digital readout IC (DROIC). This allows customers to acquire a reduced minimum order quantity of ICs at lower-cost for evaluation and prototyping.   read more 

 

 

 

 

 

Senseeker Establishes In-House Wafer Testing Capability

July 02, 2020 | Santa Barbara, CA

 

Senseeker, a leading innovator of digital infrared image sensing technology, can now respond to customer requirements more quickly by providing a cleanroom-based wafer probe capability that supports quick-turn, in-house wafer testing.   read more 

 

 

 

 

 

Senseeker Announces Availability of State-of-the-Art Digital Pixel Readout IC

March 16, 2020 | Santa Barbara, CA

 

Senseeker, a leading innovator of digital infrared image sensing technology, has announced the availability of the Magnesium™ MIL RP0092, an advanced 12 µm pitch high dynamic range dual-band digital pixel readout IC (DPROIC). Product sales are restricted to customers who have approval from the U.S. Government.   read more 

 

 

 

 

 

Senseeker Announces the World's First 8 µm Pitch, Dual-Band Infrared Imaging DROIC

February 10, 2020 | Santa Barbara, CA

 

Senseeker, a leading developer of digital infrared image sensing technology, has announced the availability of the Oxygen™ RD0092, the world's first 8 µm pitch dual-band digital readout IC (DROIC). The Oxygen RD0092 supports a 1280 x 720 frame size at over 500 fps and dual-polarity inputs to provide compatibility with all industry-standard direct-injection detector materials.   read more 

 

 

 

 

Insights

 

 

 

 

Senseeker Sponsors UCSB Engineering Capstone Cryogenic Iris Project

Alex Russell (Lead Mechanical Design Engineer) & Trevor Brake (Mechanical Design Engineer)

 

After sponsoring two electrical engineering Capstone projects in recent years with the University of California, Santa Barbara, (UCSB) College of Engineering, this year Senseeker sponsored its first mechanical engineering project with the program. For this project, industry partners and local research labs worked with a group of seniors in the College of Engineering to work on challenging projects that form the cornerstone of their educational journey. Our student team consisted of Aamir Rehman, Andrew Bresk, Eric Lemieux, Eduardo Garcia-Andres, and Daniel Chen.    read more 

 

 

 

 

 

Multi-High-Speed Windowing Capability for Infrared Object and Event Tracking

Ross Bannatyne (Director of Business Development)

 

One of the most popular features of Senseeker readout ICs is the high-speed windowing functionality that is available on commercial Senseeker chips such as Oxygen®, Magnesium® and Calcium® product lines. This feature allows the user to select regions of interest anywhere on the array and create windows of a desired size that can be read out at high speed. On many of our chips there is no limitation on the number of high-speed windows that can be set up by the user and these windows can even be set to overlap each other.    read more 

 

 

 

 

 

New XL Sensor Test Unit Option Caters for Larger FPAs and More Feedthroughs

Alex Russell (Mechanical Design Engineer) & Ross Bannatyne (Director of Business Development)

 

Advances in IC Technology make it possible to manufacture focal plane arrays (FPAs) that are larger than ever. This has led to the demand for cryogenic test equipment that can accommodate larger FPAs. Typical industry standard sensor test units (STUs) today can hold an FPA package/module of about four inches in length on each side or less. That is a pretty big package, but believe it or not, in certain cases it is just not big enough. Senseeker has developed an XL option for the popular Closed-cycle and LN2 pour-fill STUs. The new XL option provides a significantly larger vacuum enclosure in which to accommodate the FPA and all of its electrical connections.    read more 

 

 

 

 

 

Senseeker Sponsors UCSB Engineering Capstone VCO ADC Project

Sean McCotter (Analog and Mixed Signal IC Design Engineer) & Jeremiah Ford (Mixed Signal IC Design Engineer)

 

For the second year in a row, Senseeker has been proud to sponsor a team of burgeoning engineers at the University of California, Santa Barbara through the UCSB Engineering Capstone Program. In this program, both industry partners and local research labs create interesting and challenging project ideas for groups of seniors in the College of Engineering to make a reality. This puts students into an environment where they must begin to make their own decisions as engineers. Their work in these projects forms the cornerstone of their educational journey.    read more 

 

 

 

 

 

Oxygen® DROIC Neutron Testing

Zach Korth, PhD (Engineering Physicist - Test Group Manager) & Ross Bannatyne (Director of Business Development)

 

As a commercial off-the-shelf product, the Oxygen® digital readout IC (DROIC) is intended for use in a broad range of infrared imaging applications. Although the Oxygen RD0092 was not designed specifically for use in high-radiation environments, there is interest in using it in a focal plane array for an infrared camera that can be used in nuclear facilities.    read more 

 

 

 

 

 

Senseeker Expands Capabilities Further to Enable Customer's FPA Excellence

Ross Bannatyne (Director of Business Development) & Greg Pierce (Director of Infrared Systems)

 

Senseeker's recent acquisition of SE-IR has provoked a lot of interest and excitement within the U.S. infrared imaging community. Both companies have established strong reputations as essential providers of products and services to enable the development and production of focal plane arrays (FPAs). Senseeker has designed some of the world's most advanced digital readout ICs and SE-IR has provided famously robust test Dewars and electronics that have become ubiquitous across the industry. Both of these elements are vital constituents of the infrared imaging system ecosystem.   read more 

 

 

 

 

 

Senseeker's Custom Readout IC Design Will Make Your FPA All That It Can Be

Ross Bannatyne (Director of Business Development) & Thomas Poonnen, PhD (Director of Engineering)

 

Over the last decade, Senseeker has completed over forty unique digital readout IC (DROIC) and digital pixel readout IC (DPROIC) designs. Although these custom products are not available off-the-shelf like the Oxygen and the Magnesium MIL, they have provided robust and innovative solutions to developers of focal plane arrays, in many cases advancing the state-of-the-art.   read more 

 

 

 

 

 

Introducing Quarter Wafer Sales by The Slice

Ross Bannatyne (Director of Business Development) & Thomas Poonnen, PhD (Director of Engineering)

 

To provide easier access to using our innovative Oxygen® RD0092 DROIC, Senseeker has become the first supplier in the industry to offer quarter wafers. We're responding to a demand from universities and research establishments who need a reasonable quantity of dies for R&D purposes, but don't want to pay for a whole wafer when their budget can be best used on other things.   read more 

 

 

 

 

 

Simplifying Infrared Image Sensor Development with COTS Readouts and Electronics

Ross Bannatyne (Director of Business Development)

 

Senseeker's commercial off-the-shelf (COTS) readout ICs reduce the development cycle time, cost and risk of FPA development and are supported by off-the-shelf electronics evaluation kits to get started immediately. The purpose of the evaluation kits is to simplify and accelerate the evaluation of Senseeker readout ICs in the lab under uncooled or cooled conditions.   read more 

 

 

 

 

 

Senseeker Sponsors UCSB Engineering Capstone Wild Fire Defense Project

Kendall Esparza (Mixed Signal IC Design Engineer)

 

Starting back in August of 2019, Senseeker had the exciting opportunity to sponsor a group of young engineers through the Capstone program at the University of California, Santa Barbara. The students were given a simple prompt: to develop a fire detection system that can monitor large areas and sense fires quickly.   read more 

 

 

 

 

 

A New Era Emerges in User-Friendly GUI Wafer Maps

Zach Korth, PhD (Engineering Physicist - Test Group Manager)

 

At Senseeker, we try hard to differentiate ourselves by being easy to do business with and making things as simple as possible for our customers. We have recently upped our game by providing a new level of user-friendliness when shipping wafers to our customers. Senseeker now provides an executable GUI that runs on a PC to share detailed die test data for every wafer shipped.   read more 

 

 

 

 

 

Enabling the Age of Digital Pixel Infrared Imaging

Ross Bannatyne (Director of Business Development)

 

Senseeker has raised the bar for commercially available digital pixel readout ICs (DPROICs) with the new Magnesium™ MIL RP0092 for infrared reconnaissance, surveillance and target acquisition systems. However, with great power comes great responsibility, so unless you have approval from the United States Government, unfortunately this cutting-edge DPROIC is not for you.   read more 

 

 

 

 

 

A Little Unexpected Goodness

Kenton Veeder (President)

 

The news is full of failure and negativity, but my team were fully up and running and mostly working from home overnight. Other than a few minor hiccups like needing more VPN licenses and a couple system adjustments, all communications and data systems are performing well. We are backed up with data in triplicate stored in secure locations, have three independent and redundant communications systems the team is actively using and the company is generally rolling forward without issue.   read more 

 

 

 

 

 

Checkerboard HDR Infrared Imaging: Go 0 to HDR in 1 Frame!

Thomas Poonnen, PhD (Director of Engineering)

 

When we set out to design the world's first 8 µm pitch dual-band DROIC - the Oxygen™ RD0092 - we couldn't resist to also try to make it the world's best. Among the many options and features we added to this 1280 x 720 format, 500 fps digital readout, perhaps the one that stands out the most is its ability to achieve >120 dB dynamic range in dual-integration HDR mode. And the reason it stands out is that the RD0092 does not require two frames to create an HDR frame, it instead accomplishes HDR imaging in a single frame.   read more 

 

 

 

 

 

The Swiss Army Knife of DROICs ... Off-the-Shelf!

Ross Bannatyne (Director of Business Development)

 

The new Oxygen™ RD0092 isn't just remarkable in that it is the world's first 8 µm pitch Dual-Band DROIC. It isn't just remarkable either that it also integrates more advanced operating modes than any other DROIC that has ever been developed. It is remarkable because it is available to any infrared image sensor developer right off-the-shelf.   read more 

 

 

 

 

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